GLASS PROCESSING

We offer precise processing of glass in semi-optical to optical quality.

Machinery equipment:

HURCO - VMX42i

• 3-axis milling machine
  displacements: X=1065 mm, Y=610 mm, Z=610 mm
• automatic tool change
• Renishaw touch probe measuring with an accuracy of 1 µm
• maximum spindle speed: 12000 with the possibility of cooling through the center of the tool (ideal for drilling)

MIKRONEX - FCM 28 CNC

• 3-axis milling machine with an added fourth axis - a rotary table

LAPICAM 7

• horizontal lapping and polishing machine
• precise measurement of the lapping tool using the MicroEpsilon laser sensor

TWO-EXCENTRIC GRINDING AND POLISHING MACHINE MEOPTA 39.25/95

The machine is intended for grinding and polishing precise and very precise flat surfaces on boards up to 500 mm in diameter, as well as for grinding and polishing precise spherical surfaces.

• smooth regulation of spindle speed (5-100 rpm) and swing arm (0-60 rpm)
• 2-eccentric swing arm
• workpiece diameter: 100-500 mm, spherical surfaces Rmin 50, Rmax ∞

LOHTRONIC HLP-500

• 1 lapping and 2 polishing machines for large-format workpieces
• drive plate size up to 800 mm

Data processing:

We edit the data sent by the customer (ideally in stp or igs formats) in a CAD program for the subsequent generation of NC codes in CAM software. Alternatively, we will create new data according to the customer's specifications.

Examples of realizations: